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Case One
      

 
Process:TSMC 55GP
Package:4-2-4 Layer Flip-Chip BGA
Logic Gate Count:10+M Gates
Memory:112 Macro, total 32Mbit
Main Frequency:500MHz
High-speed Interface:DDRIII 1GHz Data Rate
Chip Area:9x9 mm^2 
                             
 

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